Bond

Bond Financial Technologies was an embedded-finance platform that offered APIs for card issuing (Bond Issuing), money movement (Bond Pay), deposit accounts (Bond Banking), and credit underwriting (Bond Credit) to brands and fintechs. Bond was acquired by FIS (Fidelity National Information Services) in 2023 and its product surface has been folded into Atelio by FIS at atelio.com. The original Bond developer portal and API surface at bond.tech is no longer the primary access path; new partners are routed to the Atelio platform. This is an honest historical record.

Bond is profiled on the APIs.io network. Tagged areas include Embedded Finance, Cards, Issuing, Payments, and Banking.

🌐 Visit website 📡 Source on GitHub

10.7/100 minimal ▬ flat Agent 0/100 human only Full breakdown ↓
scored 2026-07-28 · rubric v0.5

0 APIs

Embedded FinanceCardsIssuingPaymentsBankingAcquiredHistorical

Kin Score

Kin Score How this is scored →
scored 2026-07-28 · rubric v0.5

Composite quality — 10.7/100 · minimal

Contract Quality 0.0 / 25

Developer Ergonomics 0.0 / 20

Commercial Clarity 1.6 / 20

Operational Transparency 0.0 / 13

Governance 0.0 / 12

Discoverability 6.8 / 10

Agent readiness — 0/100 · human only

Machine-Readable Contract 0 / 18

Agentic Access Contract 0 / 15

MCP Server 0 / 12

Machine-Readable Auth 0 / 10

Idempotency 0 / 9

Stable Error Semantics 0 / 8

Request/Response Examples 0 / 7

Rate-Limit Signaling 0 / 7

Typed Event Surface 0 / 6

Agent Skills 0 / 5

Well-Known Catalog 0 / 4

Consent & Bot Identity 0 / 3

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Access & Security 2

Authentication, authorization, and security posture

TrustCenter

TrustCenter

DomainSecurity

DomainSecurity

Company 3

The organization behind the API

Website

Website

Crunchbase

Crunchbase

LinkedIn

Other 2

Properties that don't map to a standard resource type

Successor

Successor

ParentCompany

ParentCompany

Source (apis.yml)

aid: bond-fi
url: https://raw.githubusercontent.com/api-evangelist/bond-fi/refs/heads/main/apis.yml
name: Bond
kind: company
description: Bond Financial Technologies was an embedded-finance platform that offered APIs for card issuing (Bond Issuing),
  money movement (Bond Pay), deposit accounts (Bond Banking), and credit underwriting (Bond Credit) to brands and fintechs.
  Bond was acquired by FIS (Fidelity National Information Services) in 2023 and its product surface has been folded into Atelio
  by FIS at atelio.com. The original Bond developer portal and API surface at bond.tech is no longer the primary access path;
  new partners are routed to the Atelio platform. This is an honest historical record.
accessModel:
  pricing: unknown
  onboarding: unknown
  trial: false
  try_now: false
  public: false
  label: Unknown
  confidence: low
  source: []
  generated: '2026-07-22'
  method: derived
image: https://kinlane-images.s3.amazonaws.com/shared/apis-json/icons/bond-fi.png
tags:
- Embedded Finance
- Cards
- Issuing
- Payments
- Banking
- Acquired
- Historical
created: '2026-05-23'
modified: '2026-05-23'
specificationVersion: '0.19'
apis: []
common:
- type: TrustCenter
  url: security/bond-fi-trust-center.yml
- type: DomainSecurity
  url: security/bond-fi-domain-security.yml
- type: Website
  url: https://bond.tech/
- type: Successor
  url: https://atelio.com/
- type: ParentCompany
  url: https://www.fisglobal.com/
- type: Crunchbase
  url: https://www.crunchbase.com/organization/bond-fintech
- type: LinkedIn
  url: https://www.linkedin.com/company/bond-financial-technologies
maintainers:
- FN: Kin Lane
  email: kin@apievangelist.com

Bond

Kin Score

Security Posture 2

Bond Fi Domain Security

Bond Fi Trust Center

Resources

Access & Security 2

Company 3

Other 2

Source (apis.yml)