Kla Tencor Context

{
  "@context": {
    "@version": 1.1,
    "schema": "https://schema.org/",
    "kla": "https://www.kla.com/vocabulary#",
    "skos": "http://www.w3.org/2004/02/skos/core#",

    "Organization": "schema:Organization",
    "name": "schema:name",
    "url": "schema:url",
    "description": "schema:description",
    "industry": "schema:industry",
    "foundingDate": "schema:foundingDate",
    "legalName": "schema:legalName",
    "sameAs": "schema:sameAs",

    "KLACorporation": {
      "@id": "https://www.kla.com",
      "@type": "schema:Organization",
      "schema:name": "KLA Corporation",
      "schema:legalName": "KLA Corporation",
      "schema:url": "https://www.kla.com",
      "schema:description": "Leader in process control and process-enabling solutions for semiconductor wafer and reticle manufacturing, integrated circuits, packaging, printed circuit boards, and flat panel displays.",
      "schema:industry": "Semiconductor Equipment and Process Control",
      "schema:foundingDate": "1975",
      "schema:sameAs": [
        "https://www.linkedin.com/company/kla-corporation",
        "https://en.wikipedia.org/wiki/KLA_Corporation"
      ]
    },

    "processControl": {
      "@id": "kla:processControl",
      "@type": "skos:Concept",
      "skos:prefLabel": "Process Control",
      "skos:definition": "Systems and techniques used to monitor, measure, and control semiconductor manufacturing processes to ensure wafers and devices meet specifications."
    },

    "metrology": {
      "@id": "kla:metrology",
      "@type": "skos:Concept",
      "skos:prefLabel": "Metrology",
      "skos:definition": "Precision measurement of critical dimensions, film thickness, overlay accuracy, and other physical parameters on wafers and reticles."
    },

    "waferInspection": {
      "@id": "kla:waferInspection",
      "@type": "skos:Concept",
      "skos:prefLabel": "Wafer Inspection",
      "skos:definition": "Automated optical or electron-beam scanning of silicon wafers to detect surface defects, particles, and pattern anomalies."
    },

    "reticleInspection": {
      "@id": "kla:reticleInspection",
      "@type": "skos:Concept",
      "skos:prefLabel": "Reticle Inspection",
      "skos:definition": "High-precision inspection of photomasks used in photolithography to ensure they are free of defects."
    },

    "overlay": {
      "@id": "kla:overlay",
      "@type": "skos:Concept",
      "skos:prefLabel": "Overlay",
      "skos:definition": "The alignment accuracy between successive lithographic layers printed on a wafer."
    },

    "criticalDimension": {
      "@id": "kla:criticalDimension",
      "@type": "skos:Concept",
      "skos:prefLabel": "Critical Dimension",
      "skos:altLabel": "CD",
      "skos:definition": "The smallest feature size that must be accurately controlled in a semiconductor device."
    },

    "yieldManagement": {
      "@id": "kla:yieldManagement",
      "@type": "skos:Concept",
      "skos:prefLabel": "Yield Management",
      "skos:definition": "Practices and systems used to maximize the percentage of functional chips produced from a semiconductor wafer."
    },

    "computationalAnalytics": {
      "@id": "kla:computationalAnalytics",
      "@type": "skos:Concept",
      "skos:prefLabel": "Computational Analytics",
      "skos:definition": "Data analysis and machine learning algorithms applied to inspection and metrology data to identify patterns and optimize manufacturing processes."
    },

    "defectClassification": {
      "@id": "kla:defectClassification",
      "@type": "skos:Concept",
      "skos:prefLabel": "Defect Classification",
      "skos:definition": "Automated categorization of detected defects by type, size, and origin using machine learning and image analysis."
    },

    "advancedPackaging": {
      "@id": "kla:advancedPackaging",
      "@type": "skos:Concept",
      "skos:prefLabel": "Advanced Packaging",
      "skos:definition": "Semiconductor packaging techniques beyond traditional wire-bonding, including flip-chip, wafer-level packaging, and 2.5D/3D integration."
    },

    "Product": "schema:Product",
    "InspectionSystem": {
      "@id": "kla:InspectionSystem",
      "@type": "schema:Product",
      "skos:definition": "A hardware and software system used to detect defects on semiconductor wafers or reticles."
    },

    "MetrologyTool": {
      "@id": "kla:MetrologyTool",
      "@type": "schema:Product",
      "skos:definition": "Precision measurement equipment used to quantify physical properties of semiconductor structures."
    },

    "WaferNode": {
      "@id": "kla:WaferNode",
      "skos:prefLabel": "Wafer",
      "skos:definition": "A thin slice of semiconductor material used as the substrate for microelectronic devices."
    },

    "ReticleNode": {
      "@id": "kla:ReticleNode",
      "skos:prefLabel": "Reticle",
      "skos:altLabel": "Photomask",
      "skos:definition": "A glass plate containing the circuit pattern for a single chip layer, used in photolithography to expose wafer resist."
    }
  }
}