Amkor Technology

aid: amkor-technology
url: https://raw.githubusercontent.com/api-evangelist/amkor-technology/refs/heads/main/apis.yml
name: Amkor Technology
description: Amkor Technology is the world's largest US-based provider of outsourced semiconductor packaging and test services
  (OSAT), serving integrated device manufacturers, fabless semiconductor companies, and contract foundries. The company offers
  advanced packaging technologies including flip chip, wafer-level packaging, 2.5D/3D TSV, System-in-Package, and chiplet
  integration solutions for AI, automotive, communications, computing, consumer electronics, industrial, IoT, and networking
  markets.
image: https://kinlane-images.s3.amazonaws.com/shared/apis-json/apis-json-logo.jpg
tags:
- Semiconductor Packaging
- OSAT
- Test Services
- Advanced Packaging
- Chiplets
- Automotive
- Artificial Intelligence
- Electronics Manufacturing
- Fortune 1000
created: '2024-01-01'
modified: '2026-04-19'
specificationVersion: '0.18'
apis:
- aid: amkor-technology:website
  name: Amkor Technology Website
  tags:
  - Semiconductor Packaging
  - OSAT
  - Test Services
  image: https://kinlane-images.s3.amazonaws.com/shared/apis-json/apis-json-logo.jpg
  baseURL: https://www.amkor.com
  humanURL: https://www.amkor.com
  properties:
  - type: Website
    url: https://www.amkor.com
  description: Amkor Technology provides outsourced semiconductor packaging and test services for chip manufacturers worldwide.
    The company does not currently publish a public developer API.
common:
- type: Portal
  url: https://www.amkor.com
- type: PrivacyPolicy
  url: https://www.amkor.com/privacy-policy
- type: TermsOfService
  url: https://www.amkor.com/terms-of-use
- type: Support
  url: https://www.amkor.com/contact
- type: LinkedIn
  url: https://www.linkedin.com/company/amkor-technology
- type: X
  url: https://twitter.com/AmkorTech
- type: Features
  data:
  - name: Laminate Packaging
    description: Advanced laminate packages including CABGA, FBGA, fcCSP, FlipStack CSP, and interposer solutions for high-performance
      semiconductor devices.
  - name: Leadframe Packaging
    description: Leadframe-based packages including LQFP, TQFP, SOIC, SSOP, and fcMLF for cost-optimized semiconductor packaging.
  - name: Wafer-Level Packaging
    description: WLCSP and WL3D wafer-level packaging for compact, high-performance semiconductor packages with minimal form
      factor.
  - name: Advanced 2.5D and 3D Packaging
    description: Through-silicon via (TSV) technology for 2.5D and 3D stacked die configurations enabling high-bandwidth interconnects
      for AI and HPC applications.
  - name: System-in-Package
    description: SiP integration combining multiple chips, passives, and sensors into a single package for IoT, wearables,
      and complex electronic systems.
  - name: Chiplet Integration
    description: Proprietary S-Connect and S-SWIFT technologies for advanced chiplet integration enabling heterogeneous integration
      of multiple die from different foundries.
  - name: Power Discrete Packaging
    description: Power semiconductor packages including D2PAK, DPAK, PowerCSP, and PQFN for power management and motor control
      applications.
  - name: Memory and Sensor Packaging
    description: Specialized packaging for MEMS, image sensors, memory modules, and other sensor devices requiring precision
      assembly.
  - name: Semiconductor Testing
    description: Comprehensive semiconductor test services including wafer test, final test, and burn-in for quality assurance
      and yield optimization.
- type: UseCases
  data:
  - name: AI and High-Performance Computing
    description: Advanced 2.5D/3D packaging and chiplet integration for AI accelerators, data center GPUs, and high-performance
      computing applications.
  - name: Automotive Electronics
    description: Automotive-grade semiconductor packaging for ADAS, electrification, infotainment, and powertrain control
      modules meeting AEC-Q100 standards.
  - name: 5G Communications
    description: RF and mmWave packaging solutions for 5G base stations, smartphones, and infrastructure equipment requiring
      high-frequency performance.
  - name: Consumer Electronics
    description: Cost-optimized packaging for smartphones, tablets, wearables, and consumer devices with compact form factors
      and high integration.
  - name: Industrial and IoT
    description: Robust semiconductor packages for industrial automation, sensors, and IoT devices requiring wide operating
      temperature ranges.
  - name: Memory Packaging
    description: DRAM, NAND flash, and memory module packaging for storage and memory applications in enterprise and consumer
      markets.
- type: Integrations
  data:
  - name: Foundry Partners
    description: Collaboration with leading semiconductor foundries including TSMC, Samsung, and GlobalFoundries for seamless
      wafer-to-package supply chain integration.
  - name: EDA Tool Providers
    description: Integration with electronic design automation tools for package design, thermal simulation, and signal integrity
      analysis.
maintainers:
- FN: API Evangelist
  email: info@apievangelist.com