Amkor Technology

aid: amkor-technology
url: https://raw.githubusercontent.com/api-evangelist/amkor-technology/refs/heads/main/apis.yml
name: Amkor Technology
description: Amkor Technology is the world's largest US-based provider of outsourced semiconductor packaging and test services
  (OSAT), serving integrated device manufacturers, fabless semiconductor companies, and contract foundries. The company offers
  advanced packaging technologies including flip chip, wafer-level packaging, 2.5D/3D TSV, System-in-Package, and chiplet
  integration solutions for AI, automotive, communications, computing, consumer electronics, industrial, IoT, and networking
  markets.
deliveryModel:
  model: saas
  open_source: false
  commercial: true
  callable_host: false
  label: Hosted service · you call their endpoint
  confidence: medium
  source:
  - pricing
  generated: '2026-08-28'
  method: derived
accessModel:
  pricing: freemium
  onboarding: unknown
  trial: false
  try_now: false
  public: false
  label: Freemium
  confidence: medium
  source:
  - plans
  generated: '2026-07-22'
  method: derived
image: https://kinlane-images.s3.amazonaws.com/shared/apis-json/icons/amkor-technology.png
tags:
- Semiconductor Packaging
- OSAT
- Test Services
- Advanced Packaging
- Chiplets
- Automotive
- Artificial Intelligence
- Electronics Manufacturing
- Fortune 1000
created: '2024-01-01'
modified: '2026-09-02'
specificationVersion: '0.23'
apis:
- aid: amkor-technology:website
  name: Amkor Technology Website
  tags:
  - Semiconductor Packaging
  - OSAT
  - Test Services
  image: https://kinlane-images.s3.amazonaws.com/shared/apis-json/apis-json-logo.jpg
  baseURL: https://www.amkor.com
  humanURL: https://www.amkor.com
  properties:
  - type: Website
    url: https://www.amkor.com
  description: Amkor Technology provides outsourced semiconductor packaging and test services for chip manufacturers worldwide.
    The company does not currently publish a public developer API.
- aid: amkor-technology:b2b-integration
  name: Amkor B2B Integration Services
  tags:
  - B2B Integration
  - EDI
  - RosettaNet
  - Supply Chain
  - Semiconductor Packaging
  image: https://kinlane-images.s3.amazonaws.com/shared/apis-json/apis-json-logo.jpg
  humanURL: https://amkor.com/b2b-integration-services-solutions/
  properties:
  - type: Documentation
    url: https://amkor.com/b2b-integration-services-solutions/
  - type: Conformance
    url: conformance/amkor-technology-conformance.yml
  description: 'Amkor''s centralized B2B infrastructure for exchanging manufacturing information between its factories, sales
    teams and customers. Delivery protocols published by Amkor are RosettaNet RNIF, FTP/SFTP, EDI over VAN and AS2, SOAP Web
    Services over HTTPS, MQ and JMS; message formats are RosettaNet PIPs, delimited flat files, EDI, XML, EDI/EDIFACT, Excel
    and text reports. Transaction categories are lot status and transactions, shipping and billing information, customer purchase
    orders and build instructions. NO baseURL is recorded because Amkor publishes no endpoint, WSDL or PIP list: connectivity,
    certificates and credentials are provisioned per customer during commercial onboarding, so the surface is real but partner-gated.'
common:
- type: DomainSecurity
  url: security/amkor-technology-domain-security.yml
- type: Website
  url: https://amkor.com
- type: PrivacyPolicy
  url: https://amkor.com/privacy-notice/
- type: TermsOfService
  url: https://amkor.com/legal/
- type: Support
  url: https://amkor.com/contact-us/
- type: Blog
  url: https://amkor.com/blog/
- type: Conformance
  url: conformance/amkor-technology-conformance.yml
- type: Compliance
  url: conformance/amkor-technology-conformance.yml
- type: Lifecycle
  url: lifecycle/amkor-technology-lifecycle.yml
- type: Packages
  url: packages/amkor-technology-packages.yml
- type: LLMsTxt
  url: llms/amkor-technology-llms.txt
- type: LinkedIn
  url: https://www.linkedin.com/company/amkor-technology
- type: X
  url: https://twitter.com/AmkorTech
- type: Features
  data:
  - name: Laminate Packaging
    description: Advanced laminate packages including CABGA, FBGA, fcCSP, FlipStack CSP, and interposer solutions for high-performance
      semiconductor devices.
  - name: Leadframe Packaging
    description: Leadframe-based packages including LQFP, TQFP, SOIC, SSOP, and fcMLF for cost-optimized semiconductor packaging.
  - name: Wafer-Level Packaging
    description: WLCSP and WL3D wafer-level packaging for compact, high-performance semiconductor packages with minimal form
      factor.
  - name: Advanced 2.5D and 3D Packaging
    description: Through-silicon via (TSV) technology for 2.5D and 3D stacked die configurations enabling high-bandwidth interconnects
      for AI and HPC applications.
  - name: System-in-Package
    description: SiP integration combining multiple chips, passives, and sensors into a single package for IoT, wearables,
      and complex electronic systems.
  - name: Chiplet Integration
    description: Proprietary S-Connect and S-SWIFT technologies for advanced chiplet integration enabling heterogeneous integration
      of multiple die from different foundries.
  - name: Power Discrete Packaging
    description: Power semiconductor packages including D2PAK, DPAK, PowerCSP, and PQFN for power management and motor control
      applications.
  - name: Memory and Sensor Packaging
    description: Specialized packaging for MEMS, image sensors, memory modules, and other sensor devices requiring precision
      assembly.
  - name: Semiconductor Testing
    description: Comprehensive semiconductor test services including wafer test, final test, and burn-in for quality assurance
      and yield optimization.
- type: UseCases
  data:
  - name: AI and High-Performance Computing
    description: Advanced 2.5D/3D packaging and chiplet integration for AI accelerators, data center GPUs, and high-performance
      computing applications.
  - name: Automotive Electronics
    description: Automotive-grade semiconductor packaging for ADAS, electrification, infotainment, and powertrain control
      modules meeting AEC-Q100 standards.
  - name: 5G Communications
    description: RF and mmWave packaging solutions for 5G base stations, smartphones, and infrastructure equipment requiring
      high-frequency performance.
  - name: Consumer Electronics
    description: Cost-optimized packaging for smartphones, tablets, wearables, and consumer devices with compact form factors
      and high integration.
  - name: Industrial and IoT
    description: Robust semiconductor packages for industrial automation, sensors, and IoT devices requiring wide operating
      temperature ranges.
  - name: Memory Packaging
    description: DRAM, NAND flash, and memory module packaging for storage and memory applications in enterprise and consumer
      markets.
- type: Integrations
  data:
  - name: Foundry Partners
    description: Collaboration with leading semiconductor foundries including TSMC, Samsung, and GlobalFoundries for seamless
      wafer-to-package supply chain integration.
  - name: EDA Tool Providers
    description: Integration with electronic design automation tools for package design, thermal simulation, and signal integrity
      analysis.
maintainers:
- FN: API Evangelist
  email: info@apievangelist.com
x-enrichment:
  date: '2026-09-02'
  status: minimal
  artifacts_added: 5
  pass: local-v1
x-coverage:
  state: gated
  reason: partner-login
  detail: Amkor publishes no web API at all; its only machine-to-machine surface is the B2B Integration Services stack (RosettaNet/EDI/AS2/SFTP/SOAP)
    whose endpoints, WSDLs and PIP numbers are issued only under a commercial agreement, and the one live application host,
    api.amkor.com, answers 403 from an Imperva/Incapsula edge to every anonymous request including the site root.
  evidence:
  - url: https://api.amkor.com/
    status: 403
  - url: https://amkor.com/b2b-integration-services-solutions/
    status: 200
  - url: https://amkor.com/openapi.json
    status: 404
  - url: https://amkor.com/.well-known/agent-card.json
    status: 404
  checked: '2026-09-02'