# Bond

**Canonical:** https://apis.io/providers/bond-fi/  
**Website:** https://bond.tech/  
**APIs profiled:** 0

Bond Financial Technologies was an embedded-finance platform that offered APIs for card issuing (Bond Issuing), money movement (Bond Pay), deposit accounts (Bond Banking), and credit underwriting (Bond Credit) to brands and fintechs. Bond was acquired by FIS (Fidelity National Information Services) in 2023 and its product surface has been folded into Atelio by FIS at atelio.com. The original Bond developer portal and API surface at bond.tech is no longer the primary access path; new partners are routed to the Atelio platform. This is an honest historical record.

## Kin Score — 4.3 / 100 (minimal)

Scored 2026-08-20 under rubric 0.12.0. Trend: flat (+0.0 from 4.3).

| Facet | Score |
|---|---|
| Discoverability | 50.0 |
| Contract Quality | 0.0 |
| Governance | 0.0 |
| Contract Governance | 0.0 |
| Operational Transparency | 0.0 |
| Developer Ergonomics | 0.0 |
| Commercial Clarity | 7.9 |
| Access Clarity | 7.9 |

Regulatory layer — **Payments**: 17.2 (matched via tags).

## Agent readiness — 0.0 (human-only)

| Dimension | Value |
|---|---|
| Spec Presence | no |
| Agentic Access | no |
| Reversibility Documented | no |
| MCP Server | no |
| Auth Clarity | no |
| Idempotency | no |
| Error Semantics | no |
| OpenAPI Examples | no |
| Rate Limit Signal | no |
| Event Surface Described | no |
| Agent Skills | no |
| Well Known Catalog | no |
| Consent Identity | no |
| Agent Card | no |
| Dry Run Mode | no |

## Access

Unknown — onboarding: unknown, pricing: unknown, trial: no (confidence: low).

## Security (2)

- **Bond Fi Domain Security** — TLSv1.3 · HSTS
- **Bond Fi Trust Center** — SOC 2, PCI DSS

## Tags

Embedded Finance, Cards, Issuing, Payments, Banking, Acquired, Historical

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Profiled by [API Evangelist](https://apievangelist.com) and published on [APIs.io](https://apis.io/providers/bond-fi/). Scores are computed from the provider's own public artifacts under a published rubric.